Epoxy Resin used for EMC

1)Manufactured by Sinopec Baling Branch . 2)It is light yellow flake. 3)It is used in Epoxy MoldingCompound. 4)CAS:29690-82-2

Brand	Epoxy equivalent(g/eq)	Hydrolysable chlorine, wt% ≤	Inorgano-chlorine, wt% ≤	Softening	Melting viscosity	Volatile wt%≤	Color (Gardner) ≤	Application
				point (°C)	(mPa•s 150°C)
CYDCN-200	195~210	0.015	0.0005	60~75	340~420	0.1	2	Epoxy Molding Compound.encapsulant,electronic printing ink, laminates
CYDCN-205	193~208	0.015	0.0005	50~60	—	0.1	2
CYDCN-208	195~210	0.015	0.0005	80~95	—	0.15	2	Printed Circuit Board,electronic printing ink

Due to the multi-epoxy groups existing in the molecules of O-cresol formaldehyde epoxy reisin, a large amount of tight cross-bonds are formed after being cured, resulting in excellent thermal stability, mechanical strength, electricity insulation and chemicals resistance. It is mainly used in microelectronic industry. Widely used for the encapsulant of semiconductors and integrated circuits.

Epoxy Resin used for EMC